As the virtual reality (VR) and augmented reality (AR) markets continue to evolve, Micron remains at the forefront, driving innovation and delivering cutting-edge solutions. In one of our blogs, we discussed Micron opportunities stemming from AR and VR becoming the next generation of user interface. Likewise, our product qualifications for the Qualcomm XR2+ Gen 2 platform underscore our ongoing dedication to making the metaverse a reality. With the availability of the 500GB UFS 3.1 and 64Gb 1ß (1-beta)-based LPDDR5X, Micron is poised to meet the growing demands of VR and AR applications, enabling richer graphics, improved heat distribution and battery performance for an overall enhanced user experience.
Expanding our qualified product portfolio
Micron's innovation, quality and reliability are reflected in our ongoing portfolio enhancements. By consistently upgrading our product offerings, we ensure that our customers have access to the most advanced memory and storage solutions available. Our leading-edge DRAM is a testament to our innovation. These small form factor, fast DRAM solutions are designed to meet the rigorous demands of modern VR and AR applications. Micron memory and storage support powerful processing requirements balanced with low power consumption, which is key to current and next-gen VR performance and user expectations.
Addressing the growing capacity needs for VR
Enabling a robust VR experience in the metaverse requires complex, concurrent processing across multiple applications and sensors that are seamlessly integrated into a constantly changing view of presence, position and sensory perception in the virtual world. Cutting-edge, purpose-built multicore SoCs with onboard GPUs, along with Micron's leading-edge memory and storage solutions, enable the processing required to create a successful, immersive customer experience. LPDDR5X and UFS3.1 are excellently suited for Qualcomm-based untethered VR headsets, part of the global AR and VR market that IDC expects will grow to almost 23 million units by 2028, with a 2024-2028 compound annual growth rate of 36.3%.* These two technologies deliver next-level performance (response time, power consumption and small size) to these applications for the Qualcomm XR2 family of SoCs.
Micron UFS 3.1 500GB is a game-changer for the VR market. As the number of VR applications increase, along with their complexity, the need for robust storage solutions becomes increasingly critical. Users demand near-instant access to a broad range of content and applications, and the 500GB UFS 3.1 delivers just that. With fast loading times and on-device access, this solution ensures a seamless user experience, enabling VR enthusiasts to immerse themselves in their virtual worlds without interruption.
Micron’s LPDDR5X, which supports speed grades of up to 7.5 Gbps, readily qualifies on Qualcomm’s latest chipset, the XR2 Gen 2 SoC, purpose-built for VR. At peak data rates, Micron’s LPDDR5X memory delivers up to 33% faster performance than previous LPDDR5 solutions for improved battery performance which enhances the user’s experience, allowing one to spend more time in a spatial / virtual experience. Micron LPDDR5X and UFS 3.1 solutions enable concurrent processing across multiple applications and sensors while seamlessly integrating a constantly changing view of presence, position and sensory perception in the metaverse. This performance, balanced with low power consumption, is critical.
Collaborating with industry leaders
Micron's success in the VR and AR markets is bolstered by our continued collaboration with leading chipset vendors like Qualcomm and original equipment manufacturers (OEMs). By working closely with these industry leaders, we ensure that our products meet stringent qualifications for VR headsets. Micron memory and storage can be found in leading VR devices from multiple device manufacturers. Our partnerships help us stay ahead of the curve, providing our customers with reliable high-performance products and support.
Looking ahead: A promising future for VR
Micron is excited about the potential of the VR market. With multiple announcements from major OEMs at CES 2024, we anticipate that 2025 will be an exciting year for VR. Micron's commitment to advancing VR and AR markets is demonstrated through our innovative product offerings and strategic collaborations. Our latest product qualifications for the Qualcomm XR2+ Gen 2 platform and the availability of the 500GB UFS 3.1 and 64Gb 1ß-based 150S LPDDR5X highlight our commitment to meeting the growing demands of these sectors. We remain focused on delivering high-performance, low-power memory and storage solutions to support the evolving needs of VR and AR applications.
Learn more about Micron’s solutions that are excellently suited for Qualcomm-based untethered VR headsets: LPDDR5X and UFS 3.1.
